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XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
sku: 1005005696746396
$21.22
~
880.00 грн.
$21.22, $1.00 = 41.45 грн.
~
2,050.00 руб.
$21.22, $1.00 = 96.66 руб.
€ 19.70
+4%
~
€ 20.50
$21.22, € 1.00 = $1.04
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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$21.26
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
93%
$20.38
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon MTK EMMC Phone Steel Mesh Repair Qualcomm
89%
$20.68
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
83%
$29.80
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
82%
$20.09
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair For iPhone A8-A16
81%
$33.71
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
+1%
80%
$28.60
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
+1%
61%
$34.68
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
+8%
59%
$56.85
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
+2%
57%
$32.34
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
56%
$7.67
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform for Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
53%
$7.67
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform for Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
51%
$23.70
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
46%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
44%
$27.06
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
-24%
43%
$17.09
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
41%
$28.77
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
40%
$27.01
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
+6%
37%
$57.37
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
35%
$6.49
XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh
34%
$31.98
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC For Qualcomm CPU Welding Repair Tools
28%
$31.56
XZZ L23 CPU Universal Reballing Stencil With Platform For iPhone A8-A16 MTK QUALCOMM Hisilicon Down CPU BGA Reballing
25%
$23.00
XZZ L23 Magnetic Tin Planting Platform For iPhone A8-A16 Android/Hisilicon/Qualcomm/MTK IC Chip BGA Universal Reballing Stencil
24%
$7.11
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform For Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
22%
$24.37
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone 6-14 A8-A16 Qualcomm MTK Hisilicon CPU tin planting soldering
18%
$27.68
XZZ L23 BGA Reballing Stencil Platform for IPhone 6-14 A8 A9 A10 A12 A13 A14 A15 A16 Qualcomm MTK Hisilicon CPU Soldering Repair
14%
$7.07
XZZ L23 CPU Universal BGA Reballing Stencil Platform for Phone 6-14 A8-A16 Qualcomm MTK Hisilicon Planting Tin Template
12%
$28.67
XZZ L23 BGA Reballing Stencil Platform Tin Plating Table Magnetic Positioning for iPhone 6-14pm Qualcomm MTK Hisilicon IC Repair
2%
$35.09
XZZ L23 High Quality Chip BGA Reballing Stencil Kits Set Solder for For IPhone 6-14ProMax Hisilicon MTK Qualcomm CPU Chip Series
1%
$28.79
XZZ L23 CPU Reballing Stencil with Position Mold BGA Reball Template for A16 A15 Qualcomm Hisilicon MediaTek Plant Tin Tools
1%
$9.22
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