XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone 6-14 A8-A16 Qualcomm MTK Hisilicon CPU tin planting soldering

XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone 6-14 A8-A16 Qualcomm MTK Hisilicon CPU tin planting soldering
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sku: 1005005558070910
$24.60-1%
$24.37
Shipping from: China
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