XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering

XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
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sku: 1005005592760977
$34.20-2%
$33.54
Shipping from: China
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