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XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
sku: 1005005592760977
$34.68
1,440.00 грн.
-1%
~
1,430.00 грн.
$34.68, $1.00 = 41.10 грн.
3,370.00 руб.
-9%
~
3,070.00 руб.
$34.68, $1.00 = 88.50 руб.
€ 32.50
-2%
~
€ 31.90
$34.68, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
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$66.00
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
+1%
97%
$32.34
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
+7%
94%
$56.85
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
-22%
78%
$17.09
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
75%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
69%
$21.26
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
68%
$21.22
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
61%
$20.38
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon MTK EMMC Phone Steel Mesh Repair Qualcomm
59%
$24.37
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone 6-14 A8-A16 Qualcomm MTK Hisilicon CPU tin planting soldering
57%
$20.68
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
+1%
52%
$28.60
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
51%
$20.09
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair For iPhone A8-A16
48%
$23.00
XZZ L23 Magnetic Tin Planting Platform For iPhone A8-A16 Android/Hisilicon/Qualcomm/MTK IC Chip BGA Universal Reballing Stencil
46%
$31.56
XZZ L23 CPU Universal Reballing Stencil With Platform For iPhone A8-A16 MTK QUALCOMM Hisilicon Down CPU BGA Reballing
43%
$29.80
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
40%
$33.71
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
+1%
34%
$27.22
XZZ L23-CPU Universal CPU Reballing Stencil Planting Platform Fixture For IPhone A8-A16 MTK Qualcomm Android IC Chip Repair Tool
27%
$27.68
XZZ L23 BGA Reballing Stencil Platform for IPhone 6-14 A8 A9 A10 A12 A13 A14 A15 A16 Qualcomm MTK Hisilicon CPU Soldering Repair
23%
$23.70
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
22%
$23.80
Universal CPU BGA Reballing Stencil Platform For iPhone A8~A16 / Qualcomm / MTK / Hisilicon IC Chipping Planting Tin Template
+5%
21%
$57.37
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
16%
$27.01
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
13%
$28.67
XZZ L23 BGA Reballing Stencil Platform Tin Plating Table Magnetic Positioning for iPhone 6-14pm Qualcomm MTK Hisilicon IC Repair
11%
$27.06
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
9%
$31.98
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC For Qualcomm CPU Welding Repair Tools
7%
$28.77
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
+1%
4%
$97.02
MaAnt Magnetic Reballing Platform CPU BGA Reballing Stencil for iPhone A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
3%
$35.09
XZZ L23 High Quality Chip BGA Reballing Stencil Kits Set Solder for For IPhone 6-14ProMax Hisilicon MTK Qualcomm CPU Chip Series
1%
$28.79
XZZ L23 CPU Reballing Stencil with Position Mold BGA Reball Template for A16 A15 Qualcomm Hisilicon MediaTek Plant Tin Tools
1%
$11.25
Набор трафаретов XZZ L23 для реболлинга процессора, для IPhone A8-A16 MTK Hisilicon, Qualcomm, универсальная Магнитная база, BGA-шарики, жестяная платформа
+13%
1%
~
$16.90
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