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XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
sku: 1005005551775128
$28.03
1,090.00 грн.
+6%
~
1,160.00 грн.
$28.03, $1.00 = 41.35 грн.
2,540.00 руб.
-3%
~
2,470.00 руб.
$28.03, $1.00 = 88.05 руб.
€ 26.10
-2%
~
€ 25.60
$28.03, € 1.00 = $1.10
Shipping from: China
the store does not ship to your country
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XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
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