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Universal BGA Reballing Stencil kit for iPhone CPU A8-A16 Hisilicon Qualcomm MTK IC Chip Glue removal tin planting platform
sku: 1005005562880124
$26.69
1,040.00 грн.
+5%
~
1,100.00 грн.
$26.69, $1.00 = 41.05 грн.
2,410.00 руб.
+1%
~
2,430.00 руб.
$26.69, $1.00 = 91.12 руб.
€ 24.70
-3%
~
€ 24.00
$26.69, € 1.00 = $1.11
Shipping from: China
the store does not ship to your country
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