XZZ L23 CPU Universal BGA Reballing Stencil Platform for Phone 6-14 A8-A16 Qualcomm MTK Hisilicon Planting Tin Template

XZZ L23 CPU Universal BGA Reballing Stencil Platform for Phone 6-14 A8-A16 Qualcomm MTK Hisilicon Planting Tin Template
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sku: 1005005582778795
$6.95+1%
$7.03
Shipping from: China
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