MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh

MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh
thumb
thumb
thumb
thumb
thumb
thumb
sku: 1005005671574312
$4.22-12%
$3.72
Shipping from: China
   Price history chart & currency exchange rate

Customers also viewed