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XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh
sku: 1005005610048943
$6.49
266.00 грн.
+2%
~
272.00 грн.
$6.49, $1.00 = 41.85 грн.
605.00 руб.
+11%
~
670.00 руб.
$6.49, $1.00 = 103.23 руб.
€ 6.00
+4%
~
€ 6.25
$6.49, € 1.00 = $1.04
Shipping from: China
the store does not ship to your country
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55%
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XZZ L23 CPU Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin Platform
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54%
$7.07
XZZ L23 CPU Universal BGA Reballing Stencil Platform for Phone 6-14 A8-A16 Qualcomm MTK Hisilicon Planting Tin Template
53%
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MAant C1 Magnet tin planting Platform CPU Fixture For iPhone A8-A15 for QUALCOMM Hisilicon EMMC MTK BGA Reballing Stencil tools
32%
$7.67
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$3.86
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$5.07
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16%
$2.99
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1%
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