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MaAnt Qualcomm CPU Synthesis BGA Reballing Stencil For Android CPU Nand-A BGA496 BGA566 HI6260 SM8250 IC Chip Tin Plant Net Set
sku: 1005006478471153
$1.67
67.50 грн.
+6%
~
71.50 грн.
$1.67, $1.00 = 42.70 грн.
156.00 руб.
+11%
~
173.00 руб.
$1.67, $1.00 = 103.86 руб.
€ 1.54
+7%
~
€ 1.65
$1.67, € 1.00 = $1.01
Shipping from: China
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MaAnt Qualcomm CPU Synthesis BGA Reballing Stencil For Android CPU Nand-A BGA496 BGA566 HI6260 SM8250 IC Chip Tin Plant Net Set
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MaAnt CPU Chip BGA Reballing Stencil Kits Soldering Steel Mesh For Android Phone MTK Qualcomm HiSilicon Planting Tin Template
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30%
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27%
$3.86
MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh
24%
$4.40
Amaoe MQ3 BGA Reballing Stencil Template for Qualcomm Snapdragon 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Net
22%
$2.58
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20%
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MaAnt BGA Reballing Stencil Kit For iPad air 2/3/4/5/6/PRO/mini/2020/A12X CPU NAND IC Planting Tin Template Soldering Steel Mesh
15%
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+3%
13%
$4.27
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+1%
11%
$4.98
Amaoe MQ3 BGA Reballing Stencil for SM8250 MT6885Z SM6125 SM7150 SM7250 SDM865 Qualcomm MTK CPU RAM IC Chip Tin Plant Steel Mesh
9%
$2.58
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8%
$3.92
Amaoe QU8 CPU BGA Stencil Reballing For Qualcomm SM8250 102 002 SDM439 SM8350 Snapdragon888 Tin Planting Soldering Net IC Chip
5%
$4.73
MaAnt BGA Reballing Stencil For iPad Air 2 3 4 5 6 PRO Mini 2020 A12X CPU Nand Power RAM Audio IC Chip Soldering Steel Mesh
4%
$4.73
MaAnt BGA Reballing Stencil For iPhone 8-14 Pro MAX Motherboard CPU NAND IC Chipping Planting Tin Template Soldering Steel Mesh
-24%
1%
$2.58
BGA reballing Stencil Template for Qualcomm MSM SDM MDM SM CPU RAM MSM8974 SM8250/SDM439/SM8350 SDM660 SM4250/SM6125 SDM845
1%
$4.16
MaAnt BGA Reballing Stencil Kit For Xiaomi 11 Ultra 12 13Pro MAX Redmi Note CPU NAND Planting Tin Template Soldering Steel Mesh
+3%
1%
$2.29
0.12MM Amaoe BGA Reballing Stencil QU8 For SM8250/SDM439/SM8350/Qualcomm Snapdragon 888/CPU Steel Mesh
1%
$4.48
Amaoe BGA Reballing Stencil QU8 For SM8250/SDM439/SM8350/Qualcomm Snapdragon 888/CPU Steel Mesh
+3%
1%
$2.21
Amaoe QU8 BGA Reballing Stencil For SM8350 SDM439 SM8250 102/002 For Qualcomm Snapdragon 888 CPU RAM BGA Direct Heat Template
1%
$2.61
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1%
$4.24
Amaoe QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 BGA Reballing Stencil Kit for Qualcomm Series CPU RAM SM8250/SDM439/SM8350 888 Steel Mesh
-3%
1%
$3.08
U-QSU1-5 BGA Reballing Stencil For Qualcomm series CPU SM8350 SM8250 SM8475 SM7325 SM7125 SM7350 SM8150 SM7250 SDM660 SDM632 Net
-2%
1%
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Amaoe U-QSU5 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU SM8550/SM8450/SM8350/SM8250/SM8475 RAM496 RAM556
1%
$197.23
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Силиконовая форма для шоколада в виде фламинго
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6/.012,911 0=.000,080 1=.000,867/1 2=.000,724/1 3=.001,013/1 4=.005,113/1 5=.000,098/1 6=.005,096/36
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