AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 865/870 SM8250 Direct heating Square hole BGA Stencil Thickness 0.12mm

AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 865/870 SM8250 Direct heating Square hole BGA Stencil Thickness 0.12mm
sku: 1005005725069386
$2.78-6%
$2.61
Shipping from: China
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