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Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
sku: 1005003597404245
$2.80
114.00 грн.
+2%
~
116.00 грн.
$2.80, $1.00 = 41.35 грн.
256.00 руб.
+7%
~
274.00 руб.
$2.80, $1.00 = 97.88 руб.
€ 2.58
+2%
~
€ 2.64
$2.80, € 1.00 = $1.06
Shipping from: China
the store does not ship to your country
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Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
97%
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Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
95%
$2.80
Wylie WL-80 BGA Reballing Stencil Qualcomm 865 SM8250 CPU RAM Chip IC for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Tin Plant Net
91%
$2.69
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
+1%
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Wylie WL-80 BGA Reballing Stencil Qualcomm 865 SM8250 CPU RAM Chip IC for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Tin Plant Net
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Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
86%
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Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
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Wylie WL-79 BGA Reballing Stencil for Xiaomi MI 11/11 Ultra/11Pro/11i/11X Pro Redmi K40 Pro Qualcomm 888 SM8350 CPU RAM IC Chip
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Wylie WL-79 BGA Reballing Stencil for Xiaomi MI 11/11 Ultra/11Pro/11i/11X Pro Redmi K40 Pro Qualcomm 888 SM8350 CPU RAM IC Chip
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Wylie WL-78 BGA Reballing Stencil for Xiaomi Redmi 9/Note 9 4G/Note9 Pro Qualcomm 662 SM6115/750G SM7225 MT6769v CPU RAM IC Chip
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MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net
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$2.94
0.12mm Amaoe Mi12 BGA Reballing Stencil For Xiaomi 10/10Pro Redmi K30 Pro 865 SM8250 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
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$2.23
Amaoe MI12 BGA Reballing Stencil Template For XIAOMI 10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU RAM Power ADUIO PM IC Chip
1%
$2.68
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$3.18
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Amaoe MQ3 BGA Reballing Stencil Template for Qualcomm Snapdragon 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Net
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0.108, 4.67
6/.054,764 0=.000,136 1=.001,587/1 2=.002,409/1 3=.001,752/1 4=.033,568/1 5=.001,354/1 6=.014,094/36
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