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Wylie WL-80 BGA Reballing Stencil Qualcomm 865 SM8250 CPU RAM Chip IC for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Tin Plant Net
sku: 1005003554408211
$2.78
+1%
$2.80
112.00 грн.
+4%
~
116.00 грн.
$2.80, $1.00 = 41.60 грн.
257.00 руб.
+15%
~
296.00 руб.
$2.80, $1.00 = 105.62 руб.
€ 2.58
+3%
~
€ 2.66
$2.80, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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$2.95
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
97%
$2.80
Wylie WL-80 BGA Reballing Stencil Qualcomm 865 SM8250 CPU RAM Chip IC for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Tin Plant Net
95%
$2.95
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
93%
$2.80
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
+1%
91%
$2.80
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
90%
$2.69
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
88%
$2.69
Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net
-5%
55%
$4.27
Amaoe Mi12 BGA Reballing Stencil For Xiaomi 10/10Pro Redmi K30 Pro 865 SM8250 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
48%
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MI12 BGA Reballing Stencil For Xiaomi 10 10Pro For Redmi K30 Pro SM8250 PM8250 RAM Tin Planting Soldering Net Repair Tools IC
47%
$2.66
Wylie WL-79 BGA Reballing Stencil for Xiaomi MI 11/11 Ultra/11Pro/11i/11X Pro Redmi K40 Pro Qualcomm 888 SM8350 CPU RAM IC Chip
45%
$2.80
Wylie WL-79 BGA Reballing Stencil for Xiaomi MI 11/11 Ultra/11Pro/11i/11X Pro Redmi K40 Pro Qualcomm 888 SM8350 CPU RAM IC Chip
42%
$2.66
Wylie WL-79 BGA Reballing Stencil for Xiaomi MI 11/11 Ultra/11Pro/11i/11X Pro Redmi K40 Pro Qualcomm 888 SM8350 CPU RAM IC Chip
37%
$2.57
MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net
35%
$2.69
Wylie WL-78 BGA Reballing Stencil for Xiaomi Redmi 9/Note 9 4G/Note9 Pro Qualcomm 662 SM6115/750G SM7225 MT6769v CPU RAM IC Chip
33%
$3.61
MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net
32%
$5.76
Amaoe MI12 BGA Reballing Stencil Template for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250 0.12mm CPU IC Chip Steel Mesh
29%
$2.77
Wylie WL-79 BGA Reballing Stencil Qualcomm 888 SM8350 for Xiaomi MI11/11 Ultra/11Pro/11i/11XPro Redmi K40 Pro CPU RAM IC Chip
25%
$2.69
Wylie WL-78 BGA Reballing Stencil for Xiaomi Redmi 9/Note 9 4G/Note9 Pro Qualcomm 662 SM6115/750G SM7225 MT6769v CPU RAM IC Chip
22%
$2.80
MI12 BGA Reballing Stencil For Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC Tin Planting Soldering Net
16%
$4.98
Amaoe MQ3 BGA Reballing Template Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU IC RAM Chip Tin Planting Net
+4%
11%
$2.94
0.12mm Amaoe Mi12 BGA Reballing Stencil For Xiaomi 10/10Pro Redmi K30 Pro 865 SM8250 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
+4%
6%
$2.23
Amaoe MI12 BGA Reballing Stencil Template For XIAOMI 10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU RAM Power ADUIO PM IC Chip
2%
$2.68
Amaoe MI12 BGA Reballing Stencil Template For XIAOMI 10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU RAM Power ADUIO PM IC Chip
1%
$3.18
For xiaomi 10/10 pro/Redmi K30 Pro Power ADUIO pm 865 SM8250 CPU RAM IC Chip BGA Reballing Stencil Solder BGA Heating Template
1%
$3.91
Amaoe MI12 BGA Reballing Stencil Template for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250 0.12mm CPU IC Chip Steel Mesh
+3%
1%
$4.00
BGA Stencil For Xiaomi Mi 10 Pro Redmi K30 Pro SM8250 Qualcomm Snapdragon 865 CPU Stencil Replanting tin seed beads BGA Stencil
1%
$3.34
Amaoe MQ3 BGA Reballing Template Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU IC RAM Chip Tin Planting Net
+10%
1%
$2.88
0.12MM Amaoe BGA Reballing Stencil MQ3 For Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net
1%
$4.40
Amaoe MQ3 BGA Reballing Stencil Template for Qualcomm Snapdragon 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Net
-4%
1%
$2.61
AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 865/870 SM8250 Direct heating Square hole BGA Stencil Thickness 0.12mm
-2%
1%
~
$5.95
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0.029, 0.86
6/.008,368 0=.000,084 1=.000,764/1 2=.000,566/1 3=.000,494/1 4=.002,963/1 5=.000,117/1 6=.003,464/36
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