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MaAnt BGA Reballing Stencil Kit For Xiaomi11 Ultra/12/13Pro MAX Redmi Note CPU NAND Planting Tin Template Soldering Steel Mesh
sku: 1005005620317080
$2.58
99.00 грн.
+8%
~
107.00 грн.
$2.58, $1.00 = 41.40 грн.
239.00 руб.
-5%
~
227.00 руб.
$2.58, $1.00 = 87.91 руб.
€ 2.40
-2%
~
€ 2.36
$2.58, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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MaAnt BGA Reballing Stencil Kit For Xiaomi 11 Ultra 12 13Pro MAX Redmi Note CPU NAND Planting Tin Template Soldering Steel Mesh
67%
$2.58
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$2.58
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+2%
55%
$4.19
MaAnt BGA Reballing Stencil Kit For iPad air 2 3 4 5 6 PRO Mini 2020 A12X CPU NAND IC Planting Tin Template Soldering Steel Mesh
52%
$4.73
MaAnt BGA Reballing Stencil For iPhone 8-14 Pro MAX Motherboard CPU NAND IC Chipping Planting Tin Template Soldering Steel Mesh
44%
$3.95
MaAnt IC Chip BGA Reballing Stencil Kit For Huawei Honor Mate Nova P60 Motherboard IC CPU NAND Planting Tin Template Steel Mesh
41%
$2.57
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40%
$2.58
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33%
$2.36
MaAnt Steel BGA Reballing Stencil for Phone VIVO IQOO11 Middle Level NAND CPU IC Tin Planting Soldering Steel Net
+1%
32%
$5.14
MaAnt BGA Reballing Stencil Template For iPhone 5 6 7 8 X XS XR 11 12 13 14 Pro MAX Mini Motherboard CPU NAND IC Planting Tin
31%
$6.88
MaAnt BGA Reballing Stencil EMMC/EMCP/NAND/Hard Disk Planting Tin Template Steel Mesh For Mobile Phone IC Chip Repair Tool
-2%
30%
$2.04
Amaoe Mbga Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
-15%
27%
$3.49
MaAnt BGA Reballing Stencil Kit For Samsung CPU IC Stencil Set Motherboard RAM Power NAND Planting Tin Heat Template
-36%
25%
$3.58
MaAnt BGA Reballing Stencil Kit For Samsung Motherboard CPU RAM Power NAND IC Chipping Planting Tin Heat Template
22%
$2.90
Amaoe Mbga Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
-10%
20%
$2.00
Amaoe Mbga Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
-6%
14%
$2.12
AMAOE IP14 A16 A15 CPU Nand BGA Reballing Stencil for iPhone 14/14 Plus/14 Pro/14 Pro Max Middle Layer Tin Planting Steel Mesh
11%
$3.80
MaAnt AMAOE Square Hole 0.12MM BGA Reballing Stencil For iPhone 13mini 13Pro 13Pro Max Motherboard IC CPU NAND Planting Tin
+1%
4%
$3.30
MaAnt XZZ XinZhiZao Square Hole 0.12MM BGA Reballing Stencil For iPhone 13 mini Pro Max Motherboard IC CPU NAND Planting Tin
1%
$4.30
Amaoe EMMC3 BGA Reballing Stencil 0.15mm For EMMC EMCP UFS UMCP LPDDR NAND PCIE Universal CPU Tin Planting Platform Steel Mesh
1%
$4.30
Amaoe EMMC3 BGA Reballing Stencil 0.15mm For EMMC EMCP UFS UMCP LPDDR NAND PCIE Universal CPU Tin Planting Platform Steel Mesh
1%
$2.56
MaAnt XZZ XinZhiZao Square Hole 0.12MM BGA Reballing Stencil For iPhone 13 mini Pro Max Motherboard IC CPU NAND Planting Tin
-1%
1%
$2.97
Amaoe MBGA Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
-13%
1%
$3.73
Amaoe EMMC3 BGA Reballing Stencil 0.15mm For EMMC EMCP UFS UMCP LPDDR NAND PCIE Universal CPU Tin Planting Platform Steel Mesh
1%
$3.00
Amaoe MBGA Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
1%
$2.14
MaAnt Qualcomm CPU Synthesis BGA Reballing Stencil For Android CPU Nand-A BGA496 BGA566 HI6260 SM8250 IC Chip Tin Plant Net Set
1%
$3.80
MaAnt AMAOE Square Hole 0.12MM BGA Reballing Stencil For iPhone 13mini 13Pro 13Pro Max Motherboard IC CPU NAND
1%
$3.76
PHONEFIX 0.15MM Silver BGA Reballing Stencil EMMC/EMCP/UFS/UMCP/LPDDR/NAND Universal Mobile Phone Repair Tin Planting Stencil
1%
$3.84
PHONEFIX 0.15MM Silver BGA Reballing Stencil EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE Universal Planting Tin for Repair Mobile Phone
1%
$2.08
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1%
~
$73.00
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1%
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1%
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-4%
1%
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1%
$10.95
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