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PHONEFIX 0.15MM Silver BGA Reballing Stencil EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE Universal Planting Tin for Repair Mobile Phone
sku: 1005006735508049
$3.84
156.00 грн.
+2%
~
159.00 грн.
$3.84, $1.00 = 41.35 грн.
~
338.00 руб.
$3.84, $1.00 = 88.05 руб.
€ 3.58
-2%
~
€ 3.50
$3.84, € 1.00 = $1.10
Shipping from: China
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BGA Reballing Stencil Template For EMMC EMCP UFS UMCP LPDDR NAND BGA153 BGA169 BGA221 BGA297 BGA254 BGA178 BGA200 BGA110 BGA186
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BGA Reballing Stencil for BGA162/153/169/221/186/297/254/178/200 EMCP/EMMC/UFS/UMCP/LPDDR/NAND/PCIE Direct heating template
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AMAOE BGA Reballing Stencil for EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE/BGA153/BGA169/BGA162/BGA178/BGA200/BGA254/BGA110/BGA60/BGA70
+1%
1%
$3.95
Precise BGA Reballing Stencil for EMMC EMCP UFS UMCP LPDDR NAND PCIE BGA200 BGA153 BGA178 BGA221 Directly heating square holes
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