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Mobile Phone Parts
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair For iPhone A8-A16
артикул: 1005006083130286
$20.09
825.00 грн.
+1%
~
835.00 грн.
$20.09, $1.00 = 41.55 грн.
1,950.00 руб.
-7%
~
1,810.00 руб.
$20.09, $1.00 = 90.28 руб.
€ 18.80
+2%
~
€ 19.20
$20.09, € 1.00 = $1.05
Доставка из: Китай
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XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
85%
$21.26
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
84%
$21.22
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
78%
$20.38
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon MTK EMMC Phone Steel Mesh Repair Qualcomm
75%
$20.68
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
70%
$23.70
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
67%
$29.80
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
65%
$33.71
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
58%
$27.01
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
56%
$31.98
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC For Qualcomm CPU Welding Repair Tools
54%
$27.06
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
51%
$28.77
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
+1%
37%
$32.34
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
+7%
36%
$56.85
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
34%
$7.67
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform for Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
31%
$7.67
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform for Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
30%
$34.68
XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
25%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
24%
$7.11
XZZ L23 CPU Universal Tin Planting Table Reballing Stencil Platform For Phone A8-A16 Qualcomm MTK Hisilicon Steel Mesh
+6%
23%
$57.37
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
22%
$6.49
XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh
20%
$27.68
XZZ L23 BGA Reballing Stencil Platform for IPhone 6-14 A8 A9 A10 A12 A13 A14 A15 A16 Qualcomm MTK Hisilicon CPU Soldering Repair
-23%
18%
$17.09
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
11%
$31.56
XZZ L23 CPU Universal Reballing Stencil With Platform For iPhone A8-A16 MTK QUALCOMM Hisilicon Down CPU BGA Reballing
9%
$23.00
XZZ L23 Magnetic Tin Planting Platform For iPhone A8-A16 Android/Hisilicon/Qualcomm/MTK IC Chip BGA Universal Reballing Stencil
6%
$6.18
XINZHIZAO L23 BGA Reballing Stencil Platform for Mobile Phone A8-A16 MTK EMMC Qualcomm HUAWEI CPU Tin Planting Soldering Tools
4%
$7.07
XZZ L23 CPU Universal BGA Reballing Stencil Platform for Phone 6-14 A8-A16 Qualcomm MTK Hisilicon Planting Tin Template
3%
$24.37
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone 6-14 A8-A16 Qualcomm MTK Hisilicon CPU tin planting soldering
1%
$35.09
XZZ L23 High Quality Chip BGA Reballing Stencil Kits Set Solder for For IPhone 6-14ProMax Hisilicon MTK Qualcomm CPU Chip Series
1%
$28.79
XZZ L23 CPU Reballing Stencil with Position Mold BGA Reball Template for A16 A15 Qualcomm Hisilicon MediaTek Plant Tin Tools
О нас
Контакты
0.027, 6.41
7/.005,084 0=.000,084 1=.000,800/1 2=.000,560/1 3=.000,302/1 4=.001,249/1 5=.000,134/1 6=.001,945/30 7=.000,094/1
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