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Tool Sets
XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A16 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
артикул: 1005006136428059
$20.68
850.00 грн.
+2%
~
870.00 грн.
$20.68, $1.00 = 42.00 грн.
1,960.00 руб.
+4%
~
2,040.00 руб.
$20.68, $1.00 = 98.40 руб.
€ 19.30
+3%
~
€ 19.80
$20.68, € 1.00 = $1.04
Доставка из: Китай
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XZZ L23 Magnetic CPU BGA Reballing Stencil Kit Platform For iPhone A8-A15 Hisilicon Qualcomm MTK EMMC Phone Steel Mesh Repair
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XINZHIZAO XZZ L23 CPU Universal Tin Planting Platform for A8-A16 MTK Hisilicon Qualcomm 0.12mm BGA Reballing Stencil Steel Mesh
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XZZ L23 CPU BGA Reballing Stencil Kit For iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base Clamping Soldering
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XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A16 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
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$57.37
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21%
$17.09
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$28.77
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19%
$7.11
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17%
$27.01
XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
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$27.06
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13%
$28.67
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10%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
4%
$27.68
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1%
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О нас
Контакты
0.030, 2.2
6/.007,467 0=.000,083 1=.001,024/1 2=.000,511/1 3=.000,348/1 4=.001,812/1 5=.000,131/1 6=.003,641/36
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