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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder For Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
sku: 1005005740617740
$41.04
1,630.00 грн.
+4%
~
1,690.00 грн.
$41.04, $1.00 = 41.20 грн.
3,720.00 руб.
-2%
~
3,650.00 руб.
$41.04, $1.00 = 88.83 руб.
€ 38.10
-2%
~
€ 37.30
$41.04, € 1.00 = $1.10
Shipping from: China
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
98%
$12.63
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+6%
92%
$42.41
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
90%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
88%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
86%
$39.79
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
83%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
82%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
81%
$37.26
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
79%
$38.57
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
63%
$34.00
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Soldering Template For Kirin Qualcomm Hisilicon Snapdragon IC Chip
+1%
51%
$52.07
RELIFE RL-044 58models of Android Suites CPU Tinned BGA Reballing Stencil Set Solder for Android SMC/MTC/HIC/BGA/EXC SeriesChips
-1%
48%
$39.80
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon
47%
$42.46
RELIFE RL-044 35PCS Android CPU Tinned Chip Planting Tin Steel Stencil Set for Kirin Qualcomm Hisilicon Snapdragon Phone Repair
+2%
44%
$49.31
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
-8%
36%
$46.20
58Pcs/set BGA Reballing Stencil kit for Android CPU EMMC Qualcomm Snapdragon Exynos Hisilicon Kirin RAM Dimensity series
29%
$47.91
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
26%
$42.67
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
25%
$42.52
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
23%
$43.26
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+17%
21%
$42.88
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+15%
20%
$42.88
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
14%
$37.85
RELIFE RL-044 35pcs BGA Reballing Stencil For Android CPU Chip Planting Qualcomm Snapdragon 888 SM8350 845 SMD845 765G SM7250
12%
$13.11
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+61%
11%
$46.60
Amao CPU BGA Reballing Stencil Kit For Exynos2100 Qualcom Snapdragon MTK Hisilicon Dimensity 1000-MT6889Z Kirin 990
8%
$13.25
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
-22%
6%
$25.16
Amao CPU BGA Reballing Stencil Kit For Exynos2100 Qualcom Snapdragon MTK Hisilicon Dimensity 1000-MT6889Z Kirin 990
-1%
4%
$43.46
RL-044 Android CPU Tinned Soldering Stencil Kits For SMC Qualcomm Snapdragon Series CPU BGA Board Repair Planting Tin Use
1%
$29.47
RELIFE RL-044 For iPhone For XiaoMi For Samsung For Huawei BGA Reballing Stencil Template Solder Tin Planting Net Repair Tools
+15%
1%
$48.68
AMAOE BGA Reballing Stencil Kit Square hole for iphone Qualcomm Snapdragon MTK Helio Huawei Hisilicon Kirin Samsung Exynos
1%
~
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0.043, 8.5
7/.015,592 0=.000,100 1=.000,764/1 2=.001,035/1 3=.000,535/1 4=.000,496/1 5=.005,046/1 6=.000,127/1 7=.007,589/36
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