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Amao CPU BGA Reballing Stencil Kit For Exynos2100 Qualcom Snapdragon MTK Hisilicon Dimensity 1000-MT6889Z Kirin 990
sku: 1005005776571922
$31.80
-21%
$25.16
1,240.00 грн.
-17%
~
1,030.00 грн.
$25.16, $1.00 = 41.07 грн.
2,920.00 руб.
-23%
~
2,250.00 руб.
$25.16, $1.00 = 89.47 руб.
€ 29.40
-23%
~
€ 22.70
$25.16, € 1.00 = $1.11
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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38%
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35%
$9.97
Mechanic BGA Reballing Stencil kir for iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865
32%
$40.07
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$42.41
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$40.97
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$32.34
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27%
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24%
$38.57
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21%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
18%
$40.07
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16%
$9.32
Mechanic BGA Reballing Stencil kir for iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865
13%
$37.26
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+1%
6%
$48.83
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
+2%
5%
$8.46
MaAnt C1 BGA Reballing Stencil Platform Set for IP A8-A17 MTK Hisilicon Qualcomm EMMC SAM CPU Planting Tin Steel Mesh
4%
$34.00
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+1%
2%
$21.70
Amao UBGA CPU APU For iPhone iPad MTK Qualcom Kirin Hisilicon Samsung Huawei Honor Xiaomi Vivo OPPO Phone Positioning Plate
1%
$74.26
Maant C1 full set universal BGA Reballing Stencil kit for iPhone A8-A17 Samsung Qualcomm MTK Hisilicon CPU RAM EMMC
1%
$21.95
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1%
$12.68
Amao UBGA процессор APU для IOS iPhone iPad MTK Qualcom Kirin Hisilicon Samsung чипы для смартфонов Инструменты для ремонта позиционирования пластина
-28%
1%
$25.80
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1%
$8.55
Amaoe U-HIU2 BGA Reballing Stencil for Huawei Hisilicon CPU 970/980/990/9000/Hi3670/3680/3690/36A0/CPU RAM
1%
$24.53
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
+1%
1%
$26.55
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1%
$24.69
XZZ L23-CPU BGA Reballing Stencil Platform For iPhone A8-A15 for Hisilicon Qualcom Phone BGA Universal Reballing Stencil
1%
$13.86
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