RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
sku: 1005005690253639
1,750.00 грн.+2%
~ 1,790.00 грн.
$40.07, $1.00 = 44.55 грн.
3,090.00 руб.+1%
~ 3,120.00 руб.
$40.07, $1.00 = 77.86 руб.
€ 34.50+1%
~ € 34.90
$40.07, € 1.00 = $1.15
Shipping from: China
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