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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
sku: 1005005716963428
$12.63
505.00 грн.
+3%
~
520.00 грн.
$12.63, $1.00 = 41.15 грн.
1,150.00 руб.
+6%
~
1,210.00 руб.
$12.63, $1.00 = 96.12 руб.
€ 11.70
-1%
~
€ 11.60
$12.63, € 1.00 = $1.09
Shipping from: China
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