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Mobile Phone Parts
RELIFE RL-044 35pcs BGA Reballing Stencil For Android CPU Chip Planting Qualcomm Snapdragon 888 SM8350 845 SMD845 765G SM7250
артикул: 1005005729886361
$37.85
1,540.00 грн.
+4%
~
1,600.00 грн.
$37.85, $1.00 = 42.35 грн.
3,560.00 руб.
+10%
~
3,920.00 руб.
$37.85, $1.00 = 103.53 руб.
€ 35.20
+5%
~
€ 37.00
$37.85, € 1.00 = $1.02
Доставка из: Китай
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75%
$39.80
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon
61%
$13.25
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+3%
56%
$47.37
RELIFE RL-044 58pcs/Set Android Series Chip Tin Planting Steel Mesh Set For SMC MTC HIC EMMC ACU EXC BGA Reballing Stencil
+2%
53%
$24.44
RELIFE RL-044 58pcs/Set Android Series Chip Tin Planting Steel Mesh Set For SMC MTC HIC EMMC ACU EXC BGA Reballing Stencil
48%
$25.94
RELIFE RL-044 IP MI SAM HW Series CPU BGA Reballing Stencil Template Set For Mobile Phone Repair Tin Planting Stencil Kit
46%
$26.51
8Pcs RELIFE RL-044 For iPhone 6-13ProMax Series Chip Chipest BGA Reballing Stencil Template Tin Planting Stencil Kit Repair Tool
42%
$42.46
RELIFE RL-044 35PCS Android CPU Tinned Chip Planting Tin Steel Stencil Set for Kirin Qualcomm Hisilicon Snapdragon Phone Repair
39%
$26.84
RELIFE RL-044 8Pcs For iPhone 6-13ProMax BGA Reballing Stencil Set Template Mobile Phone Chipest Tin Planting Stencil Kit Repair
36%
$29.47
RELIFE RL-044 For iPhone For XiaoMi For Samsung For Huawei BGA Reballing Stencil Template Solder Tin Planting Net Repair Tools
34%
$23.68
RELIFE RL-044 8Pcs For iPhone 6-13ProMax Series Chipset BGA Reballing Stencil Set Template Repair Tin Planting Stencil Kit Tools
29%
$12.63
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
27%
$37.09
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
24%
$34.00
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Soldering Template For Kirin Qualcomm Hisilicon Snapdragon IC Chip
23%
$41.04
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder For Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
18%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
16%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
13%
$38.57
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
12%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
9%
$17.99
RELIFE RL-044 IP MI HW SAM Series CPU Integrated Stencil Set for Mobile Phone Repair Tin Planting BGA Reballing Steel Mesh
6%
$39.79
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+1%
5%
$43.41
RELIFE RL-044 58PCS Android Phone BGA Reballing Stencil Set Android Series Chip Tin Planting Steel Mesh Set BGA Template
-8%
4%
$36.87
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
-5%
1%
$48.26
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
1%
$41.89
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
1%
$37.26
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
1%
$43.26
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
-5%
1%
$48.26
RELIFE RL-044 Android Phone BGA Reballing Stencil Set ACU1-4 HIC1-9 EMMC1-6 MTC1-11 EXC1-7 SMC1-21 Planting Tin Steel
1%
$35.03
RELIFE RL-044 Android Phone BGA Reballing Stencil Set ACU1-4 HIC1-9 EMMC1-6 MTC1-11 EXC1-7 SMC1-21 Planting Tin Steel
+2%
1%
$43.40
RELIFE RL-044 Android Phone BGA Reballing Stencil Set ACU1-4 HIC1-9 EMMC1-6 MTC1-11 EXC1-7 SMC1-21 Planting Tin Steel
1%
$11.39
BGA Reballing Stencil Kit for Qualcomm Snapdragon 888/SM8350 Direct heating BGA Template Tin planting platform
1%
$3.23
2Pcs Simple Design Hair Bun Stick Creative Ponytail Clip Delicate Girl Headdress
1%
$19.74
360° Rotation Glock 19 Holster For Glock 23 Glock32 Gen 1,2,3,4,5 Glock19 Gen5 Paddle Holster Tactical G19 Belt Loop Holster
1%
$11.69
Туристические палки, аксессуары для путешествий, трость для пешего туризма, сумка для переноски, навес, сумка для хранения, трость для путеш...
1%
$14.05
New Bow Pearl Girls Princess Shoes Heart Bling Children Flats Shoes Fashion Hook Loop Toddler Kids Mary Janes Single Shoes
1%
$37.77
12V 24V Car Truck Soup Porridge Digester Mini Rice Cooker Food Steamer Electric Heating Rice Box Rice Heater Heater 1.2L
+12%
1%
~
$273.00
A Companion to Forensic Anthropology
О нас
Контакты
0.045, 13.83
6/.013,612 0=.000,149 1=.001,076/1 2=.000,935/1 3=.000,917/1 4=.005,236/1 5=.000,140/1 6=.005,308/36
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