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Tool Sets
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Soldering Template For Kirin Qualcomm Hisilicon Snapdragon IC Chip
артикул: 1005005712544838
$34.00
1,400.00 грн.
+3%
~
1,440.00 грн.
$34.00, $1.00 = 42.35 грн.
3,230.00 руб.
+9%
~
3,520.00 руб.
$34.00, $1.00 = 103.53 руб.
€ 31.70
+5%
~
€ 33.20
$34.00, € 1.00 = $1.02
Доставка из: Китай
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81%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
79%
$39.79
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
77%
$41.89
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
-8%
74%
$36.87
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
72%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
69%
$37.26
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
66%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
63%
$38.57
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
58%
$41.04
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder For Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
55%
$12.63
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
53%
$37.09
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
46%
$42.46
RELIFE RL-044 35PCS Android CPU Tinned Chip Planting Tin Steel Stencil Set for Kirin Qualcomm Hisilicon Snapdragon Phone Repair
-5%
39%
$48.26
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
31%
$47.91
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
28%
$43.26
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
-5%
24%
$40.31
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
23%
$42.52
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
22%
$42.88
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
20%
$39.80
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon
17%
$42.67
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
+2%
12%
$51.34
58Pcs/set BGA Reballing Stencil kit for Android CPU EMMC Qualcomm Snapdragon Exynos Hisilicon Kirin RAM Dimensity series
+1%
4%
$52.74
RELIFE RL-044 58models of Android Suites CPU Tinned BGA Reballing Stencil Set Solder for Android SMC/MTC/HIC/BGA/EXC SeriesChips
2%
$43.46
RL-044 Android CPU Tinned Soldering Stencil Kits For SMC Qualcomm Snapdragon Series CPU BGA Board Repair Planting Tin Use
1%
$37.85
RELIFE RL-044 35pcs BGA Reballing Stencil For Android CPU Chip Planting Qualcomm Snapdragon 888 SM8350 845 SMD845 765G SM7250
1%
$35.03
RELIFE RL-044 Android Phone BGA Reballing Stencil Set ACU1-4 HIC1-9 EMMC1-6 MTC1-11 EXC1-7 SMC1-21 Planting Tin Steel
1%
$13.25
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
1%
$48.68
AMAOE BGA Reballing Stencil Kit Square hole for iphone Qualcomm Snapdragon MTK Helio Huawei Hisilicon Kirin Samsung Exynos
1%
$13.11
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
1%
$17.99
RELIFE RL-044 IP MI HW SAM Series CPU Integrated Stencil Set for Mobile Phone Repair Tin Planting BGA Reballing Steel Mesh
+3%
1%
$47.37
RELIFE RL-044 58pcs/Set Android Series Chip Tin Planting Steel Mesh Set For SMC MTC HIC EMMC ACU EXC BGA Reballing Stencil
-1%
1%
$2.64
Cartoon Cake Love Sanrio Keychain Kawaii Cute Pink Llaveros Juguetes Para Niños Inquietos 산리오 Schoolbag Decor Kids Gift игрушки
-4%
1%
~
$9.10
Набор полотенец Лен наш Рецепты недели 152269 (34x61, бежевый/коричневый)
+1%
1%
$20.67
For Valve Cover to Intake Crankcase Breather Hose Pipe Connector for EOS Touareg Phaeton CC Passat Audi Q7 03H103202D
-3%
1%
~
$2.60
Шампунь Unice с экстрактами чеснока и плюща, 400мл, Турция
1%
$49.27
clip beads, concentration training, pick up bean balls, intelligence, thinking, action toys
1%
$8.06
46 Bluzka Koszula Damska Biała Duża
О нас
Контакты
0.038, 7.15
6/.014,345 0=.000,085 1=.001,015/1 2=.000,688/1 3=.000,337/1 4=.005,550/1 5=.000,162/1 6=.006,593/36
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