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RELIFE RL-044 35PCS Android CPU Tinned Chip Planting Tin Steel Stencil Set for Kirin Qualcomm Hisilicon Snapdragon Phone Repair
артикул: 1005005707598387
$42.46
1,690.00 грн.
+4%
~
1,760.00 грн.
$42.46, $1.00 = 41.35 грн.
3,870.00 руб.
+8%
~
4,180.00 руб.
$42.46, $1.00 = 98.47 руб.
€ 39.20
+2%
~
€ 40.00
$42.46, € 1.00 = $1.06
Доставка из: Китай
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82%
$42.52
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
79%
$42.67
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
75%
$43.26
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+12%
70%
$42.88
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
69%
$47.91
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
+9%
65%
$42.02
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
60%
$38.00
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
-1%
59%
$39.80
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon
56%
$13.25
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
55%
$33.87
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
54%
$38.49
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
52%
$13.11
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
51%
$37.82
35pcs RELIFE RL-044 Android CPU Tinned IC Chip Planting Tin BGA Steel Stencil Set For Xiaomi Samsung Huawei Repair Tools
50%
$36.50
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
48%
$38.84
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
41%
$38.57
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
40%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+4%
37%
$53.10
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
35%
$34.00
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Soldering Template For Kirin Qualcomm Hisilicon Snapdragon IC Chip
33%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+4%
31%
$41.89
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
28%
$38.58
RELIFE RL-044 35PCS Android Series Chip Planting Tin Steel Stencil Set Android CPU for Various Chips CPU Tinned
27%
$37.26
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
25%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
22%
$39.79
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
19%
$40.07
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
14%
$36.77
RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Various Chips
12%
$41.04
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder For Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
10%
$37.09
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
1%
$37.85
RELIFE RL-044 35pcs BGA Reballing Stencil For Android CPU Chip Planting Qualcomm Snapdragon 888 SM8350 845 SMD845 765G SM7250
-2%
1%
~
$5.75
Кошелек Baellerry N2345 coffee
1%
~
$95.50
Стеганая куртка из смесовой ткани "BLEND BHOuterwear", зеленый
+37%
1%
$1.82
1Pair 1.5cm Width Women Slip Resistant Bra Straps Women Double Shoulder Elastic Brassiere Lady Bra Strap Accessories
1%
$11.46
Boy school autumn shoes men breathable massage wedge sneakers men's leisure outside comfort vulcan shoes
+8%
1%
~
$34.80
Аккумулятор для электроинструмента, SBP1204
+39%
1%
$1.80
Flat Elastic Silk Shoe Laces Cute Girly Style Lace Fungus Shoelaces for Sneakers Shoes Accessories Tennis Shoestrings for AF1
О нас
Контакты
0.033, 3.07
6/.013,641 0=.000,071 1=.000,909/1 2=.000,808/1 3=.000,253/1 4=.005,180/1 5=.000,123/1 6=.006,368/36
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