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BGA Reballing Stencil Kit for Qualcomm Snapdragon 888/SM8350 Direct heating BGA Template Tin planting platform
артикул: 1005005554476823
$11.39
468.00 грн.
+2%
~
478.00 грн.
$11.39, $1.00 = 41.95 грн.
1,060.00 руб.
+7%
~
1,140.00 руб.
$11.39, $1.00 = 100.00 руб.
€ 10.60
+4%
~
€ 11.00
$11.39, € 1.00 = $1.04
Доставка из: Китай
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1%
$26.55
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Футболка с принтом "команда бомбонок", мужские и женские футболки
О нас
Контакты
0.035, 2.68
6/.012,007 0=.000,054 1=.000,656/1 2=.000,570/1 3=.000,227/1 4=.005,131/1 5=.000,100/1 6=.005,323/36
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