PHONEFIX 0.12mm Universal CPU Series BGA Reballing Stencil Template For Samsung S8 Note 8 G9500 G9505 BGA Repair Soldering Tool

PHONEFIX 0.12mm Universal CPU Series BGA Reballing Stencil Template For Samsung S8 Note 8 G9500 G9505 BGA Repair Soldering Tool
sku: 32983930042
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$5.99
Shipping from: China
   Technical Details
Advantage: Best BGA Repair Solution for Samsung Circuit Board
Application: phone repair tool
Brand Name: DIYPHONE
Color: As Pictures Shows
Compacity: for Samsung S8 Note8
design: Anti-Drum up Design of Heat Dissipation Hole
DIY Supplies: Electrical
Drop ship: Support
Features: High Quality Direct Heating MSM8998 CPU IC Reballing
Function: Phone BGA Reballing Kit for Rework Station
item name: BGA Reballing Stencils Template
Material: Japan Stainless Steel Sheet
Model Number: G9500/G9505 /G955U/N9500 / N9505 Android
Package: Box
Size: BGA Reballing Stencil
Suitable for: A467 MTK Huawei PMB9933 Samsung CPU BGA Reballing
Supplier: DIYPHONE
Thickness: 0.12MM
Type: Phone Repair tool
Usage: for Samsung Series New type Tin Net
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