PHONEFIX 0.12mm Universal CPU Series BGA Reballing Stencil Template For Samsung S8 Note 8 G9500 G9505 BGA Repair Soldering Tool
sku: 32983930042
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$5.99
Shipping from: China
Technical Details
Advantage: | Best BGA Repair Solution for Samsung Circuit Board |
Application: | phone repair tool |
Brand Name: | DIYPHONE |
Color: | As Pictures Shows |
Compacity: | for Samsung S8 Note8 |
design: | Anti-Drum up Design of Heat Dissipation Hole |
DIY Supplies: | Electrical |
Drop ship: | Support |
Features: | High Quality Direct Heating MSM8998 CPU IC Reballing |
Function: | Phone BGA Reballing Kit for Rework Station |
item name: | BGA Reballing Stencils Template |
Material: | Japan Stainless Steel Sheet |
Model Number: | G9500/G9505 /G955U/N9500 / N9505 Android |
Package: | Box |
Size: | BGA Reballing Stencil |
Suitable for: | A467 MTK Huawei PMB9933 Samsung CPU BGA Reballing |
Supplier: | DIYPHONE |
Thickness: | 0.12MM |
Type: | Phone Repair tool |
Usage: | for Samsung Series New type Tin Net |
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