PHONEFIX 0.12mm CPU Universal S6 S6+ NOTE 5 Series BGA Reballing Stencils for Samsung Exynos 7420 Multi-function Heating Stencil

PHONEFIX 0.12mm CPU Universal S6 S6+ NOTE 5 Series BGA Reballing Stencils for Samsung Exynos 7420 Multi-function Heating Stencil
sku: 32983280900
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$5.99
Shipping from: China
   Technical Details
Advantage: Best BGA Repair Solution for Samsung Circuit Board
Application: phone repair tool
Brand Name: DIYPHONE
Color: As Pictures Shows
Compacity: for Samsung Motherboard Repair
design: CPU Universal Series, AMAO Plant-Tin Soldering Net
DIY Supplies: Electrical
Drop ship: Support
Features: Multi-purpose Samsung BGA Reballing
Function: Phone BGA Reballing Kit for Rework Station
item name: BGA Reballing Stencil Template
Material: Imported Japan Steel Sheet
Model Number: for Samsung S6 S6+ NOTE5 G9200 G9250 N9200
Package: Box
Size: 0.12mm
Suitable for: for Samsung CPU Universal Series Board Heating
Supplier: DIYPHONE
Thickness: 0.12mm
Type: Phone Repair tool
Usage: Multi-purpose Font BGA Reballing Stencil Template
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