PHONEFIX AMAOE Qualcomm BGA Reballing Stencil for Phone MSM7225A MSM8928B CPU Soldering 0.12MM Tin Plant Direct Heating Template
sku: 33001058446
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.99
Shipping from: China
Technical Details
| Advantage: | Best BGA Repair Solution for Phone Circuit Board |
| Application: | Professional Mobile Phone CPU Soldering Repair |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| Compacity: | for MSM8928 A / MSM8909 / MSM8940(MSM8937) / MSM8952 / MSM8612 / SDM66 |
| design: | Anti Drum Design of Heat Dissipation Hole |
| DIY Supplies: | Electrical |
| Features: | Vent Prevent Drum Design |
| Function: | for Phone Universal Rework Station |
| item name: | AMAOE BGA Reballing Stencil |
| Material: | Imported Japan Steel Mesh |
| Model Number: | MSM7225A / MSM8928 B |
| Package: | Box |
| Period of Dispatch: | Within 3 Days |
| Size: | 0.12mm BGA Reballing |
| Suitable for: | for Phone Reballing Operation |
| Supplier: | DIYPHONE |
| Thickness: | 0.12mm |
| Type: | Phone Repair tool |
| Usage: | for Phone Motherboard BGA Rework Repair Tool |
Price history chart & currency exchange rate