PHONEFIX Multi-Purpose 0.12MM Qualcomm Qu1/2/3/4 CPU MSM Series universal BGA Reballing Stencil Template For Cell Phone Repair

PHONEFIX Multi-Purpose 0.12MM Qualcomm Qu1/2/3/4 CPU MSM Series universal BGA Reballing Stencil Template For Cell Phone Repair
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sku: 32885599619
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.88
Shipping from: China
   Technical Details
Application: Mobile phone repair
Brand Name: DIYPHONE
DIY Supplies: Electrical
Model Number: BGA Reballing Stencil
Package: Bag
Size: 0.12MM
Type: BGA Reballing Stencil
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