Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net

Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
sku: 1005005436770296
$4.16
Shipping from: China
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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
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Amaoe Q888 BGA Stencil For Snapdragon 888 SDM888 CPU RAM Top Upper Layer Lower Bottom IC Chip Solder Tin Plant Net Steel Mesh
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59%
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Amaoe Q888 BGA Stencil For Snapdragon 888 SDM888 CPU RAM Top Bottom Layer Upper Lower Chip IC Solder Tin Plant Net Steel Mesh
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1%
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