Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net

Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
sku: 1005005436770296
$4.16
Shipping from: China
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