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AMAOE SDM439 Lower CPU BGA Reballing Stencil for Qualcomm Snapdragon 439 0.12mm Tin Planting Steel Mesh
sku: 1005005343225283
$2.99
121.00 грн.
+2%
~
123.00 грн.
$2.99, $1.00 = 41.15 грн.
270.00 руб.
+3%
~
278.00 руб.
$2.99, $1.00 = 92.90 руб.
€ 2.76
-3%
~
€ 2.68
$2.99, € 1.00 = $1.12
Shipping from: China
the store does not ship to your country
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AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
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AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
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AMAOE Q888 BGA Reballing Stencil for Qualcomm Snapdragon CPU Universal Tin Planting Steel Mesh
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42%
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Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
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Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
14%
$2.74
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11%
$4.40
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1%
$2.71
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro SE Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
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1%
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