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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
sku: 1005004093595635
$4.38
180.00 грн.
+1%
~
182.00 грн.
$4.38, $1.00 = 41.58 грн.
414.00 руб.
-3%
~
402.00 руб.
$4.38, $1.00 = 91.75 руб.
€ 4.10
+2%
~
€ 4.18
$4.38, € 1.00 = $1.05
Shipping from: China
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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
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Amaoe Q888 BGA Stencil For Snapdragon 888 SDM888 CPU RAM Top Upper Layer Lower Bottom IC Chip Solder Tin Plant Net Steel Mesh
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Amaoe Q888 BGA Stencil For Snapdragon 888 SDM888 CPU RAM Top Bottom Layer Upper Lower Chip IC Solder Tin Plant Net Steel Mesh
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AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
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Amaoe BGA Reballing Stencil Q888 For Qualcomm Snapdragon 888CPU Upper layer Lower layer Steel Mesh
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1%
$4.48
Amaoe BGA Reballing Stencil QU8 For SM8250/SDM439/SM8350/Qualcomm Snapdragon 888/CPU Steel Mesh
+11%
1%
$3.04
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+3%
1%
$2.29
0.12MM Amaoe BGA Reballing Stencil QU8 For SM8250/SDM439/SM8350/Qualcomm Snapdragon 888/CPU Steel Mesh
1%
$2.26
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1%
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-1%
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-1%
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BU-1010-A-36-2
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