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AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
sku: 1005006072418572
$6.10
+1%
$6.18
251.00 грн.
+2%
~
256.00 грн.
$6.18, $1.00 = 41.40 грн.
575.00 руб.
-6%
~
540.00 руб.
$6.18, $1.00 = 87.08 руб.
€ 5.70
-1%
~
€ 5.65
$6.18, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
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$6.10
AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
79%
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AMAOE SDM439 Lower CPU BGA Reballing Stencil for Qualcomm Snapdragon 439 0.12mm Tin Planting Steel Mesh
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Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
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57%
$2.99
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47%
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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
40%
$7.80
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50Pro Qualcomm Snapdragon 778G SM7325 MT6877V CPU Planting Tin Net Repair Tool
37%
$4.50
AMAOE SM8150 BGA Reballing Stencil for Android Phone Qualcomm Snapdragon 855 CPU PM8150 Tin Planting Template Solder Steel Mesh
34%
$2.85
Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8350 CPU RAM IC Chipset Tin Net Planting Soldering Steel Mesh
31%
$4.50
AMAOE SM8150 BGA Reballing Stencil for Android Phone Qualcomm Snapdragon 855 CPU PM8150 Tin Planting Template Solder Steel Mesh
25%
$3.89
Amaoe BGA Reballing Stencil for LGV50/SAMSUNG S10/MI9/IQ00 Qualcomm Snapdragon 855/SM8150 CPU IC Chip Tin Planting Soldering Net
22%
$4.41
Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
19%
$2.86
Amaoe BGA Reballing Stencil Q888 For Qualcomm Snapdragon 888CPU Upper layer Lower layer Steel Mesh
16%
$4.50
Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
11%
$2.33
1005006236030228
8%
$2.70
Suit to AMAOE SM8150/ plant tin net/Qualcomm Snapdragon 855CPU/ Cover upper layer /CPU lower layer/steel net
7%
$4.40
Amaoe MQ3 BGA Reballing Stencil Template for Qualcomm Snapdragon 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Net
5%
$2.27
AMAOE SM8250/SM8150 BGA Reballing Stencil/Snapdragon 865/855/CPU/ Upper/Lower/Steel Stencil
4%
$4.98
Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
-2%
1%
$2.34
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
1%
$4.51
Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
-6%
1%
$2.26
AMAOE BGA Reballing Stencil for SM7550 Qualcomm Snapdragon 7Gen3 CPU Precision square hole BGA template Tin planting platform
1%
$11.10
Amaoe SM8450 CPU BGA Reballing Stencil Platform For Qualcomm Snapdragon 8 Gen1/SM8450 IC Chip Planting Tin Template Repair Kits
1%
$16.82
BGA Reballing Stencil Kit for Qualcomm Snapdragon 855/845/SDM845/SM8150/RAM556 Direct heating BGA Template Tin planting platform
1%
$2.74
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
1%
$2.90
Amaoe U-QSU 1-5 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon SM8450/SM8350/SM6225/SM8150/SDM636 RAM496 RAM556
1%
$2.61
AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 855/730/845 SM8150 SM7150 SDM845 BGA245 Direct heating BGA Template
1%
$2.92
Amaoe U-QSU BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU SM8450/SM8350/SM6225/SM8150/SDM636 RAM496 RAM556
1%
$25.25
For Bosch 12V Rechargeable Ni-MH Power Tool Battery 4.8AH 6.8AH 9.8AH BAT043 D70745 PSR12 GSB12 GSR12 BAT038 BAT045 BAT040
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1%
~
$19.30
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1%
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