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Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh
артикул: 1005006112898064
$6.54
268.00 грн.
+1%
~
271.00 грн.
$6.54, $1.00 = 41.40 грн.
610.00 руб.
-7%
~
570.00 руб.
$6.54, $1.00 = 87.08 руб.
€ 6.10
-2%
~
€ 6.00
$6.54, € 1.00 = $1.09
Доставка из: Китай
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Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh
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Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh
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О нас
Контакты
0.048, 9.15
7/.020,752 0=.000,088 1=.001,726/1 2=.002,402/1 3=.000,464/1 4=.000,593/1 5=.007,203/1 6=.000,110/1 7=.008,254/36
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