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Welding & Soldering Supplies
Amaoe Mbga-B6 BGA Reballing Stencil Kits Platform For Android Mobile Phone Glue Removal Positioning Board CPU Tin Planting Net
артикул: 1005005954081210
$7.22
297.00 грн.
+1%
~
300.00 грн.
$7.22, $1.00 = 41.55 грн.
695.00 руб.
-6%
~
650.00 руб.
$7.22, $1.00 = 90.28 руб.
€ 6.70
+3%
~
€ 6.90
$7.22, € 1.00 = $1.05
Доставка из: Китай
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55%
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54%
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AMAOE Mbga-B9 BGA Reballing Stencil Platform for Huawei Android Phone CPU Planting Tin Glue Removal Positioning Board CPU
53%
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52%
$2.60
AMAOE Mbga-B9 BGA Reballing Stencil Platform For Android Phone CPU Planting Tin Glue Removal Positioning Board CPU Steel Mesh
50%
$4.50
AMAOE Mbga-B9 BGA Reballing Stencil Platform for Android Phone CPU Planting Tin Glue Removal Positioning Board CPU Steel Mesh
47%
$2.47
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40%
$10.84
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34%
$2.48
AMAOE Mbga-B15 Mbga-B16 SM8250 Tin Planting Platform Set Glue Removing Station Positioning Plate 0.12mm BGA Reballing Stencil
30%
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Amaoe Mbga-DR1 4 in 1 BGA Reballing Stencil for BGA200 Steel Mesh Positioning Plate Tin Ball CPU IC Chip Planting Soldering Net
28%
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22%
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16%
$18.27
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14%
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Amaoe Mbga-B11 7 In 1 BGA Reballing Stencil For A8-A14 CPU Glue Remove Positioning Plate Tin Planting Platform
9%
$11.99
AMAOE TV EMMC 4in1 Planting Tin Platform Set for BGA153 BGA169 with Positioning Board Mbga-MY3 BGA Reballing Stencil
2%
$3.93
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1%
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1%
$8.54
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1%
$3.20
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1%
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1%
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1%
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Amaoe Mbga Middle Layer BGA Reballing Stencil for Iphone 13/13 Pro/13 Mini/13Pro Max With NAND Planting Tin Template Steel Mesh
О нас
Контакты
0.041, 2.8
7/.011,201 0=.000,115 1=.000,779/1 2=.000,590/1 3=.000,475/1 4=.005,222/1 5=.000,099/1 6=.003,876/30 7=.000,159/1
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