AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template

AMAOE BGA Reballing Stencil Kit Qualcomm Tin Mesh Solder Template for MSM7225A MSM 8988B CPU Tin Plant Directly Heating Template
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sku: 33047275922
$5.99
Shipping from: China
   Technical Details
Application: BGA rework station accessory
Function: Reballing Assistant
Model Number: Qualcomm BGA Reballing Stencil
Particle Size: 1-10μm
Thickness: 0.12mm
Type: Reballing stencil
   Price history chart & currency exchange rate

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