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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
sku: 1005002762152887
$4.59
189.00 грн.
+1%
~
191.00 грн.
$4.59, $1.00 = 41.55 грн.
423.00 руб.
+17%
~
495.00 руб.
$4.59, $1.00 = 107.88 руб.
€ 4.22
+3%
~
€ 4.36
$4.59, € 1.00 = $1.05
Shipping from: China
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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
96%
$4.98
Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
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Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
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Mechanic BGA Reballing Stencil for SDM845/710/660/670/SM8150/SM6150/MSM8996/8992/8909/8928/8952/8940/8998/8953/8937/8976 CPU IC
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Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
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Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
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Amaoe RAM2 RAM1 BGA Reballing Stencil for BGA216 168 256 136 366 556 272 MSM 8992 8956 8974 8928 CPU Upper Layer RAM Steel Mesh
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0.037, 5.39
6/.015,037 0=.000,127 1=.001,026/1 2=.000,909/1 3=.001,015/1 4=.005,470/1 5=.000,152/1 6=.006,465/36
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