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BGA Reballing Stencil for Qualcomm Snapdragon 410/615/210/617/439 MSM8916 MSM8939 MSM8909 MSM8952 SDM439 Direct heating Template
sku: 1005005688592196
$2.61
102.00 грн.
+6%
~
108.00 грн.
$2.61, $1.00 = 41.40 грн.
236.00 руб.
-3%
~
228.00 руб.
$2.61, $1.00 = 87.54 руб.
€ 2.42
-1%
~
€ 2.40
$2.61, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
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AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
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AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
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BGA Reballing Stencil For Qualcomm CPU MSM7225 MSM8928 MSM8940/8937 SDM660 MSM8909 MSM8994 MSM8952 MSM8974 MSM8960 MSM8612
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$4.16
Amaoe QU8 BGA Reballing Stencil for SM8250 SDM439 SM8350 Qualcomm Snapdragon 888 CPU RAM Chip IC Steel Mesh Tin Plant Net
1%
$4.38
Amaoe QU8 BGA Reballing Stencil for SM8250 SDM439 SM8350 Qualcomm Snapdragon 888 CPU RAM Chip IC Steel Mesh Tin Plant Net
1%
$4.80
BGA Reballing Stencil For Qualcomm CPU MSM7225 MSM8928 MSM8940/8937 SDM660 MSM8909 MSM8994 MSM8952 MSM8974 MSM8960 MSM8612
1%
$2.04
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1%
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Mijing QU1-QU4 BGA Reballing Stencil Kit for Qualcomm Series CPU 0.12mm MSM8996A MSM8916 MSM8952 MSM8960 Steel Mesh
1%
$4.33
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-1%
1%
$4.59
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1%
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Black steel BGA reballing stencil for Qualcomm MSM8940 MT6797W MT6795W MSM8998 MSM8939 MT6750 MT6595 MSM8909 SDM660 PM power ic
+8%
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1%
$4.98
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1%
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Black steel BGA reballing stencil for Qualcomm MSM8940 MT6797W MT6795W MSM8998 MSM8939 MT6750 MT6595 MSM8909 SDM660 PM power ic
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~
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0.037, 11.84
7/.011,756 0=.000,068 1=.000,669/1 2=.000,631/1 3=.000,448/1 4=.000,609/1 5=.004,389/1 6=.000,127/1 7=.004,883/36
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