Mijing QU1-QU4 BGA Reballing Stencil Kit for Qualcomm Series CPU 0.12mm MSM8996A MSM8916 MSM8952 MSM8960 Steel Mesh

Mijing QU1-QU4 BGA Reballing Stencil Kit for Qualcomm Series CPU 0.12mm MSM8996A MSM8916 MSM8952 MSM8960 Steel Mesh
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sku: 1005005825770332
$4.40+1%
$4.44
Shipping from: China
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