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BGA Reballing Stencil Kit for Qualcomm Snapdragon 855/845/SDM845/SM8150/RAM556 Direct heating BGA Template Tin planting platform
артикул: 1005005539319363
$16.82
690.00 грн.
+1%
~
700.00 грн.
$16.82, $1.00 = 41.55 грн.
1,580.00 руб.
-4%
~
1,520.00 руб.
$16.82, $1.00 = 90.28 руб.
€ 15.70
+2%
~
€ 16.10
$16.82, € 1.00 = $1.05
Доставка из: Китай
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О нас
Контакты
0.044, 4.4
6/.014,331 0=.000,093 1=.001,213/1 2=.000,590/1 3=.000,735/1 4=.005,289/1 5=.000,111/1 6=.006,393/36
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