183 degree Sn62.8 Pb36.8 Ag0.4 Medium Temperature Lead Solder Paste Phone motherboard BGA chip Soldering Tin Cream

183 degree Sn62.8 Pb36.8 Ag0.4 Medium Temperature Lead Solder Paste Phone motherboard BGA chip Soldering Tin Cream
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sku: 32914383972
$4.99
Shipping from: China
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