Sn62.8 Ag0.4Silver Solder Paste Melting point:181℃ Soldering For PCB IC Medium Temperature Mobile Phone Re pair BGA Welding Flux

Sn62.8 Ag0.4Silver Solder Paste Melting point:181℃ Soldering For PCB IC Medium Temperature Mobile Phone Re pair BGA Welding Flux
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sku: 1005004327400544
$8.75+6%
$9.25
Shipping from: China
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