Lead-free Syringe Liquid Flux Soldering Paste Low Temperature Melting Point 183 Degree Tin Solder Paste for BGA PCB Welding Tool
Technical Details
Application: | BGA Reballing work |
Melting Point: | 183 degrees |
Model Number: | Green-01 |
Particle Size: | 25-48μm |
Type: | Solder Flux |
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