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Wylie WL-69 BGA Reballing Stencil For Samsung CPU RAM Power WiFi IC Chip S9 S9+ Plus Snapdragon SDM845 Exynos 9810 PM845 BGA153
sku: 1005003592017633
$2.88
-2%
$2.83
112.00 грн.
+4%
~
116.00 грн.
$2.83, $1.00 = 41.10 грн.
268.00 руб.
-7%
~
249.00 руб.
$2.83, $1.00 = 87.94 руб.
€ 2.72
-6%
~
€ 2.56
$2.83, € 1.00 = $1.11
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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$2.95
Wylie WL-69 BGA Reballing Stencil For Samsung CPU RAM Power WiFi IC Chip S9 S9+ Plus Snapdragon SDM845 Exynos 9810 PM845 BGA153
+1%
90%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
88%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
87%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
86%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
+1%
85%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
82%
$2.66
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
63%
$2.55
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
+1%
54%
$2.80
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
51%
$2.80
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
48%
$2.69
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
46%
$2.95
Wylie WL-68 BGA Reballing Stencil For SM8150 PM8150 CPU RAM Power IC Chip Samsung S10 Xiaomi 9 LG V50 Vivo IQOO BGA153 OPM2622
43%
$2.66
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
41%
$2.80
Wylie WL-68 BGA Reballing Stencil For Samsung S10 Xiaomi 9 LG V50 Vivo IQOO BGA153 OPM2622 SM8150 PM8150 CPU RAM Power IC Chip
35%
$2.95
Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
32%
$2.95
Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
+4%
30%
$2.98
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
+3%
28%
$2.98
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
23%
$5.04
Wylie WL-62 BGA Reballing Stencil For Huawei Kirin970 P20 Mate 10 Hi6370 Hi6363 Hi6423 Hi6523 Hi6421 BGA153 CPU RAM Power IC
17%
$2.80
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
15%
$2.77
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
-1%
11%
$2.80
Wylie WL-51 BGA Reballing Stencil For Nand Flash EMMC BGA221 BGA153 BGA169 BGA254 BGA162 BGA186 IC Chip Tin Plant Net Steel Mesh
5%
$2.70
Wylie WL-68 BGA Reballing Stencil For Samsung S10 Xiaomi 9 LG V50 Vivo IQOO BGA153 OPM2622 SM8150 PM8150 CPU RAM Power IC Chip
3%
$3.98
MI9 BGA Reballing Stencil For Xiaomi 8 8SE Mix2S SDM845 SDM710 For Snapdragon 845 710 PM845 PMI8998 SDR845 CPU Tin Planting Net
1%
$5.20
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
1%
$2.80
Wylie WL-74 BGA Reballing Stencil Kirin990 Hi3690/Hi9500 CPU for HUAWEI Nova 6 5G/Honor V30 5G BGA153 BGA200 Planting Tin Net
1%
$3.98
Amaoe MI9 BGA Reballing Stencil For Xiaomi 8 8SE Mix2S SDM845 SDM710 For Qualcomm Snapdragon 845 710 PM845 PMI8998 PM8005 SDR845
+1%
1%
$4.07
Amaoe BGA Reballing Stencil For Samsung S9 S9+ CPU Exynos 9810 SDM845 Snapdragon 845 Re-balling Tin Net
1%
$4.75
Amaoe BGA reballing stencil For XIAOMI 8 8SE MIX 2S Snapdragon 845 710 SDM845 SDM710 PM845 CPU POWER Chip BGA Chip Tin Plant Net
1%
$3.39
WL-68 WL-69 Black steel BGA reballing stencil Template for Samsung S10 S9 S9+ PM845 SDM845 MAX77705 SM8150 PM8150
+1%
1%
$0.93
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1%
~
$103.00
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1%
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0.047, 12.87
7/.024,709 0=.000,092 1=.000,898/1 2=.005,361/1 3=.000,702/1 4=.001,128/1 5=.006,043/1 6=.000,700/1 7=.009,877/36
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