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Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
sku: 1005003118506618
$2.78
+1%
$2.80
112.00 грн.
+4%
~
116.00 грн.
$2.80, $1.00 = 41.60 грн.
257.00 руб.
+15%
~
296.00 руб.
$2.80, $1.00 = 105.62 руб.
€ 2.58
+3%
~
€ 2.66
$2.80, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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99%
$2.66
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
98%
$2.69
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
97%
$2.80
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
-1%
80%
$2.86
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
77%
$2.95
Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
73%
$2.95
Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
+2%
70%
$2.98
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
54%
$6.81
PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 PM845 Audio WIFI NAND CPU RAM Power IC Chip BGA Stencil Reballing Template
51%
$2.46
Mechanic BGA Reballing Stencil for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423 CPU Power IC Chip
48%
$7.51
PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 PM845 Audio WIFI NAND CPU RAM Power IC Chip BGA Stencil Reballing Template
47%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
46%
$5.20
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
+3%
42%
$2.95
Wylie WL-69 BGA Reballing Stencil For Samsung CPU RAM Power WiFi IC Chip S9 S9+ Plus Snapdragon SDM845 Exynos 9810 PM845 BGA153
40%
$2.80
Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
38%
$2.46
Mechanic BGA Reballing Stencil for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423 CPU Power IC Chip
29%
$2.80
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
27%
$5.55
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
23%
$2.77
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
21%
$3.89
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
18%
$7.60
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
16%
$6.95
Black stencil PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
11%
$6.98
Black stencil PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
10%
$3.99
Black stencil SDM845 PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
8%
$6.25
WL-60 BCM43596 SDM845 PM845 SDR845 WCN9341 HI6423 WCD9335 HI6363 PM670 PM670A/L HI6421WIFI Power IC Chip BGA Reballing Stencil
3%
$8.12
Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
1%
$7.40
Black steel BGA reballing stencil for SDM845 PM670 HI6421 HI6363 SDR845 WCN9341 PM845 WCD9335 BCM43596
1%
$6.20
Black steel BGA reballing stencil for SDM845 PM670 HI6421 HI6363 SDR845 WCN9341 PM845 WCD9335 BCM43596
1%
$3.60
Black steel BGA reballing stencil for SDM845 PM670 HI6421 HI6363 SDR845 WCN9341 PM845 WCD9335 BCM43596
1%
$3.80
High quality Black steel BGA reballing stencil for SDM845 PM670 HI6421(V610) HI6363 SDR845 WCN9341 PM845 WCD9335 BCM43596
1%
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0.026, 3.91
7/.008,643 0=.000,089 1=.000,581/1 2=.000,453/1 3=.000,475/1 4=.000,407/1 5=.002,420/1 6=.000,102/1 7=.004,205/36
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