Teevo Kaisi 0.12mm BGA Reballing Stencil Solder Template for iPhone IC CPU (A-13) 11ProProMax

Teevo Kaisi 0.12mm BGA Reballing Stencil Solder Template for iPhone IC CPU (A-13) 11ProProMax
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sku: 1005006527555288
$4.16+2%
$4.24
Shipping from: China
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