Teevo Kaisi 0.12mm BGA Reballing Stencil Solder Template for iPhone IC CPU ( A-9 ) 6S/6SP

Teevo Kaisi 0.12mm BGA Reballing Stencil Solder Template for iPhone IC CPU ( A-9 ) 6S/6SP
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sku: 1005006577254086
$4.31
Shipping from: China
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