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Silver Steel BGA Reballing Stencil for HUAWEI MSM8956 MSM8976 MSM8996 MSM8992 MSM8998 CPU IC Chip Tin Planting Soldering Net
sku: 1005005732359147
$2.11
87.50 грн.
+2%
~
89.50 грн.
$2.11, $1.00 = 42.35 грн.
201.00 руб.
+8%
~
217.00 руб.
$2.11, $1.00 = 102.91 руб.
€ 1.96
+5%
~
€ 2.06
$2.11, € 1.00 = $1.02
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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Mechanic BGA Reballing Stencil for Huawei Series MSM8956 MSM8976 MSM8992 MSM8996 msm8998 CPU RAM IC Chip Universal Steel Stencil
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$2.40
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0.032, 2.76
7/.012,501 0=.000,127 1=.000,634/1 2=.000,425/1 3=.000,385/1 4=.000,402/1 5=.005,044/1 6=.000,108/1 7=.005,503/36
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