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WL-57 BGA Reballing Stencil for Huawei Series MSM8956 MSM8976 MSM8996 MSM8992 MSM8998 CPU RAM IC Chip Universal Steel Stencil
sku: 1005005732312240
$1.03
~
42.80 грн.
$1.03, $1.00 = 41.55 грн.
98.50 руб.
-8%
~
90.50 руб.
$1.03, $1.00 = 88.01 руб.
€ 0.96
+2%
~
€ 0.98
$1.03, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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Wylie WL-57 BGA Stencil Reballing For Huawei MSM8996 MSM8992 MSM8998 MSM8956 MSM8976 CPU RAM Chip IC Tin Plant Net Steel Mesh
63%
$2.86
Wylie WL-57 BGA Reballing Stencil For Huawei MSM8996 MSM8992 MSM8998 MSM8956 MSM8976 CPU RAM Chip IC Tin Net Black Steel Mesh
61%
$2.83
Wylie WL-57 BGA Reballing Stencil For Huawei MSM8996 MSM8992 MSM8998 MSM8956 MSM8976 CPU RAM Chip IC Tin Net Black Steel Mesh
60%
$2.11
Silver Steel BGA Reballing Stencil for HUAWEI MSM8956 MSM8976 MSM8996 MSM8992 MSM8998 CPU IC Chip Tin Planting Soldering Net
59%
$2.69
Wylie WL-57 BGA Stencil Reballing For Huawei MSM8996 MSM8992 MSM8998 MSM8956 MSM8976 CPU RAM Chip IC Tin Plant Net Steel Mesh
57%
$2.80
Wylie WL-57 BGA Stencil Reballing For Huawei MSM8996 MSM8992 MSM8998 MSM8956 MSM8976 CPU RAM Chip IC Tin Plant Net Steel Mesh
50%
$2.88
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42%
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34%
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18%
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10%
$2.85
AMAOE BGA Reballing Stencil For MSM8956 8976 MSM8974 MSM8992 MSM8994 MSM8996 MSM8998 MT6595 MT6795W MT6797W CPU RAM IC Tin Net
9%
$2.96
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6%
$2.85
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+3%
1%
$2.26
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1%
$2.23
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+1%
1%
$2.99
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+7%
1%
$2.89
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-1%
1%
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-2%
1%
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1%
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1%
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1%
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+1%
1%
~
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0.044, 2.91
6/.024,488 0=.000,142 1=.000,956/1 2=.005,540/1 3=.000,910/1 4=.006,158/1 5=.000,110/1 6=.010,814/36
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