Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repai

Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repai
sku: 1005003705941681
$12.16
Shipping from: China
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