Original Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA FIX

Original Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA FIX
thumb
thumb
thumb
thumb
sku: 1005004955440951
$19.99
Shipping from: China
   Price history chart & currency exchange rate

Customers also viewed